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The Effects of Surface Finish Roughness on Intermetallic Layer Growth, Intermetallic Interface Roughness, and Solder Joint Reliability

机译：表面粗糙度对金属间层生长，金属间界面粗糙度和焊点可靠性的影响

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《Proceedings of the 56th IEEE Holm Conference on Electrical Contacts》|2010年|p.1-5|共5页
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Rodekohr C. L.; Bozack M. J.; Flowers G. T.; Suhling J. C.; Rodekohr D. A.;
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1. The growth and roughness evolution of intermetallic compounds of Sn-Ag-Cu/Cu interface during soldering reaction [J] . D.Q.Yu, L.Wang Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2008,第1a2期

机译：Sn-Ag-Cu / Cu界面金属间化合物在钎焊反应过程中的生长和粗糙度演变
2. Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene [J] . Ko Yong-Ho, Lee Jong-Dae, Yoon Taeshik, ACS applied materials & interfaces . 2016,第8期

机译：控制无铅锡焊层与层间转移石墨烯的界面反应和金属间化合物的生长
3. Effect of randomness of Cu-Sn intermetallic compound layer thickness on reliability of surface mount solder joints [J] . Huang W., Palusinski O.A. IEEE Transactions on Advanced Packaging . 2000,第2期

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4. The Effects of Surface Finish Roughness on Intermetallic Layer Growth, Intermetallic Interface Roughness, and Solder Joint Reliability [C] . Rodekohr C. L., Bozack M. J., Flowers G. T., Proceedings of the 56th IEEE Holm Conference on Electrical Contacts . 2010

机译：表面粗糙度对金属间层生长，金属间界面粗糙度和焊点可靠性的影响
5. A Numerical Study of 2-D Surface Roughness Effects on the Growth of Wave Modes in Hypersonic Boundary Layers. [D] . Fong, Kahei Danny. 2017

机译：二维表面粗糙度对高超声速边界层波模增长影响的数值研究。
6. Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints [O] . Jenn-Ming Song, Bo-Chang Huang, David Tarng, 2020

机译：界面金属间化合物层纳米力学响应与焊点冲击可靠性的关系
7. Effects of Intermetallic Morphology at the Metallic Particle/Solder Interface on Mechanical Properties of Sn-Ag-Based Solder Joints [O] . Rhee, H., Guo, F., Lee, J. G., 2003

机译：金属颗粒/焊剂界面的金属间形态对Sn-Ag基焊点力学性能的影响
8. Formation of Intermetallic Compounds in Solder Joints and Its Effects on Joint Reliability. [R] . Zeng, K., Peng, W., Kivilahti, J. 2001

机译：焊点中金属间化合物的形成及其对接头可靠性的影响。

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