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Post-silicon is too late avoiding the $50 million paperweight starts with validated designs

机译:后硅片为时已晚,避免5000万美元的纸镇始于经过验证的设计为时已晚

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To ensure that an intellectual property (IP) block is validated ahead of its use in an ‘unknown’ system-on-chip (SoC) context, an holistic view of the integration process must be taken. We will focus on the challenges faced in integrating and manufacturing advanced low-power processor based SoC systems, which have dramatically increased the complexity & state space for logical and electrical validation. We describe the process taken by IP providers, tool vendors and the foundry supply chain to enable first time logical, electrical and manufacturing closure. We discuss how feedback is used to improve component IP validation strategies and interoperability and integration testing. We also cover techniques such as the role of hardware/software emulation for configuration testing, the application of formal techniques and advanced electrical rules checking. In addition, we will examine the role waivers and automated design-in guidelines to enable the integrator to balance risk reduction and design turnaround time. Finally we discuss manufacturing tests and how to link these back to improve the metrics used for component and integration level testing.
机译:为了确保在“未知”片上系统(SoC)上下文中使用知识产权(IP)块之前对其进行验证,必须对集成过程进行全面了解。我们将专注于集成和制造基于低功耗处理器的先进SoC系统所面临的挑战,这些挑战已大大增加了逻辑和电气验证的复杂度和状态空间。我们描述了IP提供商,工具供应商和铸造供应链采取的过程,以实现首次逻辑,电气和制造封闭。我们将讨论如何使用反馈来改进组件IP验证策略以及互操作性和集成测试。我们还将介绍诸如硬件/软件仿真在配置测试中的作用,形式技术的应用以及高级电气规则检查之类的技术。此外,我们将研究角色放弃和自动设计指南,以使集成商能够平衡降低风险和缩短设计周转时间。最后,我们讨论了制造测试以及如何将其链接回去以改进用于组件和集成级别测试的指标。

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