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A New Read-Disturb Failure Mechanism Caused by Boosting Hot-Carrier Injection Effect in MLC NAND Flash Memory

机译:一种新的读干扰失效机制,由MLC NAND闪存中的热载体注射效果引起

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In this paper, we have reported a new failure phenomenon of read-disturb in MLC NAND flash memory caused by boosting hot-carrier injection effect. 1) The read-disturb failure occurred on unselected WL (WLn+1) after the adjacent selected WL (WLn) was performed with more than 1K read cycles. 2) The read-disturb failure of WLn+1 depends on WLn cell's Vth and its applied voltage. 3) The mechanism of this kind of failure can be explained by hot carrier injection that is generated by discharging from boosting voltage in unselected cell area (Drain of WLn) to ground (Source of WLn).
机译:在本文中,我们报告了通过提高热载体喷射效果引起的MLC NAND闪存中的读干扰的新故障现象。 1)在具有超过1K读取周期的相邻选择的WL(WLN)之后,在未选择的WL(WLN + 1)上发生读干扰故障。 2)WLN + 1的读干扰失效取决于WLN Cell的Vth及其施加的电压。 3)这种故障的机理可以通过热载体喷射来解释,其通过从升压电压(WLN的漏极)中的升压电压(WLN的漏极)中的升压电压来解释。

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