首页> 外文会议>35th IEEE Photovoltaic Specialists Conference >Diffused junctions in multicrystalline silicon solar cells studied by complementary scanning probe microscopy and scanning electron microscopy techniques
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Diffused junctions in multicrystalline silicon solar cells studied by complementary scanning probe microscopy and scanning electron microscopy techniques

机译:通过互补扫描探针显微镜和扫描电子显微镜技术研究多晶硅太阳能电池中的扩散结

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The junction location in textured n+-p multicrystalline Si solar cell devices is quantitatively located. A comprehensive comparison is presented between secondary ion mass spectrometry (SIMS) and three microscopy techniques: scanning capacitance microscopy (SCM), scanning Kelvin probe microscopy (SKPM), and secondary electron contrast (SE) in the scanning electron microscope. The comparison includes capabilities of junction allocation, applicability of the measurement to give a two-dimensional analysis of a textured device, apparent imaging of the depletion region, depletion edge and depletion width determination, sample structure requirements for the specific methods, ease of sample preparation, and data acquisition time for high-quality measurements. We find that SE not only allows the most straightforward sample preparation and provides the quickest measurement, but also seems to show the depletion edge and width with a high degree of accuracy. This is verified by a comparison to PC1D simulations of the band bending in the bulk of the device. These data also contribute to our understanding of the origin of SE doping contrast. SKPM provides reliable junction identification but poor capability in determining the depletion width. All three techniques are able to show how well the diffused n+ emitter region tracks the surface topography, with SCM and SE yielding the clearest images.
机译:n + -p型多晶Si太阳能电池器件中的结位置被定量定位。在二次离子质谱(SIMS)和三种显微镜技术之间进行了全面的比较,这三种技术分别是:扫描电容显微镜(SCM),扫描开尔文探针显微镜(SKPM)和扫描电子显微镜中的二次电子对比(SE)。比较包括结点分配功能,对带纹理的设备进行二维分析的测量适用性,耗尽区的明显成像,耗尽边缘和耗尽宽度确定,特定方法的样品结构要求,样品制备的简易性,以及用于高质量测量的数据采集时间。我们发现SE不仅允许最直接的样品制备并提供最快的测量,而且似乎可以高度准确地显示出耗尽边缘和宽度。通过与PC1D仿真对大部分设备中的带弯曲进行比较,可以验证这一点。这些数据也有助于我们理解SE掺杂对比的起源。 SKPM提供可靠的结点识别,但确定耗尽宽度的能力较弱。这三种技术都能显示出扩散的n + 发射极区域对表面形貌的跟踪情况,其中SCM和SE产生的图像最清晰。

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