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Local thermal conductivity of polycrystalline AlN ceramics measured by scanning thermal microscopy and complementary scanning electron microscopy techniques

         

摘要

The local thermal conductivity of polycrystalline aluminum nitride (AlN) ceramics is measured and imaged by using a scanning thermal microscope (SThM) and complementary scanning electron microscope (SEM) based techniques at room temperature.The quantitative thermal conductivity for the AlN sample is gained by using a SThM with a spatial resolution of sub-micrometer scale through using the 3w method.A thermal conductivity of 308 W/m·K withingrains corresponding to that of high-purity single crystal AlN is obtained.The slight differences in thermal conduction between the adjacent grains are found to result from crystallographic misorientations,as demonstrated in the electron backscattered diffraction.A much lower thermal conductivity at the grain boundary is due to impurities and defects enriched in these sites,as indicated by energy dispersive X-ray spectroscopy.

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  • 来源
    《中国物理:英文版》 |2012年第1期|374-379|共6页
  • 作者单位

    a)Institute of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China;

    Institute of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China;

    Department of Electronics, Faculty of Electrical, Information and Media Engineering, University of Wuppertal,Wuppertal D-42119, Germany;

    Department of Electronics, Faculty of Electrical, Information and Media Engineering, University of Wuppertal,Wuppertal D-42119, Germany;

    Institute of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China;

    Institute of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China;

    Institute of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China;

    Department of Electronics, Faculty of Electrical, Information and Media Engineering, University of Wuppertal,Wuppertal D-42119, Germany;

    Institute of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China;

    Department of Materials Science, Zhejiang University, Hangzhou 300038, China;

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