首页> 外文会议>Proceedings of The 22nd International Symposium on Power Semiconductor Devices IC's >A study of p stopper effect on 30V-gate/80V-dram bi-directional NMOSFET and 80V ESD protection BJT
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A study of p stopper effect on 30V-gate/80V-dram bi-directional NMOSFET and 80V ESD protection BJT

机译:p阻塞对30V栅极/ 80V DRAM双向NMOSFET和80V ESD保护BJT的研究

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This paper describes the impact of the introduction of a p stopper to a 30V-gate bi-directional NMOSFET and an ESD protection BJT fabricated using our 80V-class HV-MOS process. We found that the p stopper that selectively formed below the channel region of the NMOSFET not only helped to prevent the S-D punch-through but also caused some important effects: (i) alleviated the electric field crowding without sacrificing the optimized resurf breakdown voltages at high drain bias, and (ii) intensified the crowding near the channel surface with increasing the channel length at a high common-G/S/D bias. We confirmed that the former effect improved both the current and the on/off-breakdown performance while the latter did not decrease the usable source bias, which equals the rated gate voltage of 30V. The p stopper applied to the core base edge of the BJT also made some snapback current evade from flowing near the surface, which increased the secondary breakdown current by over 30%. These p stoppers did not require an extra mask step in our 80V-MOS process.
机译:本文介绍了将p型塞子引入30V栅极双向NMOSFET和使用我们的80V级HV-MOS工艺制造的ESD保护BJT的影响。我们发现,选择性地在NMOSFET沟道区下方形成的p塞不仅有助于防止SD穿通,而且还产生了一些重要的影响:(i)缓解了电场拥挤而又不牺牲高电压下的优化的surf击穿电压漏极偏置,以及(ii)在较高的G / S / D偏置高的情况下,随着沟道长度的增加,加剧了沟道表面附近的拥挤。我们确认,前者的效果同时改善了电流性能和开/关击穿性能,而后者并未降低可用的源偏置,后者等于30V的额定栅极电压。施加在BJT核心底部边缘的p挡块还避免了在表面附近流动的回跳电流,这使二次击穿电流增加了30%以上。这些p型塞子在我们的80V-MOS工艺中不需要额外的掩膜步骤。

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