Simple, compact, robust and high-performance power module T-PM (transfer-molded power module)

摘要

A simple, compact, robust and high-performance power module T-PM incorporating a modified version of the previously reported Direct Lead Bonding (DLB) technology in which a lead is directly soldered to chips and a newly developed Thermally Conductive electrically Insulated Layer (TCIL) has been developed. It has three advantages. First, the DLB technology maintains a more than 10 times longer power cycling lifetime for a temperature swing of ΔTj=100°C;. Second, the newly developed TCIL successfully reduces the thermal conductance of an entire module. Finally, numerical simulation results clearly indicate that the DLB technology is effective to maintain both temperature and current distribution across all inner chip surfaces uniform.