首页> 外文会议>Proceedings of the Ninth IEEE Sensors Conference >A novel SOI-based single proof-mass 3-axis accelerometer with gap-closing differential capacitive electrodes in all sensing directions
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A novel SOI-based single proof-mass 3-axis accelerometer with gap-closing differential capacitive electrodes in all sensing directions

机译:一种新颖的基于SOI的单质量质量3轴加速度计,在所有感测方向上均具有间隙闭合差分电容电极

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This study presents a novel capacitive-type single proof-mass 3-axis accelerometer implemented on SOI wafer. This accelerometer contains special designed gap-closing differential sensing electrodes in all sensing directions. The present SOI-based 3-axis accelerometer has four merits, (1) the proof-mass is composed of device and handle layers of SOI wafer, (2) the sensitivity is improved by the gap-closing differential electrodes design in all sensing directions, (3) the sensing gap thickness is precisely defined by the box-oxide layer of SOI wafer, and (4) the poly-refilled via is used to implement the vertical interconnection between device layer and handle layer. In application, the single proof-mass 3-axis accelerometer is fabricated and characterized. The preliminary measurement results demonstrate the sensitivities of accelerometer are 9.56mV/G (X-axis), 6.9mV/G (Y-axis) and 14.51mV/G (Z-axis).
机译:这项研究提出了一种在SOI晶圆上实现的新型电容式单质量质量3轴加速度计。该加速度计在所有传感方向上都包含专门设计的间隙闭合差分传感电极。当前基于SOI的3轴加速度计具有四个优点,(1)质量由SOI晶片的器件层和处理层组成,(2)通过在所有传感方向上均采用缝隙闭合差分电极设计来提高灵敏度。 ,(3)感测间隙的厚度由SOI晶片的盒状氧化层精确定义,并且(4)多晶硅填充过孔用于实现器件层和处理层之间的垂直互连。在应用中,制造并表征了单质量质量三轴加速度计。初步测量结果表明,加速度计的灵敏度分别为9.56mV / G(X轴),6.9mV / G(Y轴)和14.51mV / G(Z轴)。

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