Wafer-level inspection system for the automated testing of comb drive based MEMS sensors and actuators

摘要

This work describes the design and experimental evaluation of a system for the non-contact testing of MEMS transducers on wafer level. The measurement principle is based on the optical detection of vibrating MEMS structures at their specific natural frequency. The working principle is demonstrated by testing a wafer with microfabricated microgrippers. Defective microgrippers are automatically identified.