A novel approach to embed off-chip RF passives in PCB based on thin film technology

摘要

Embedding passive components (EPCs) is known as a promising technology to provide high electrical performance and to reduce fabrication cost. This paper describes a novel approach to embed off-chip RF passives based on thin film stack. Multilayer structures are built-up on temporary glass carrier substrates by repetitive application of spin-coated polyimide layers and sputtered metal layers. After processing and testing the structures can easily be released from the carrier and embedded inside PCB or FCB (flexible PCB).