首页> 外文会议> >Effect of several processing parameters on material removal ratio in the deliquescent polishing of KDP crystals
【24h】

Effect of several processing parameters on material removal ratio in the deliquescent polishing of KDP crystals

机译:KDP晶体潮解性抛光中几种工艺参数对材料去除率的影响

获取原文

摘要

A new ultraprecision machining technology for potassium dihydrogen phosphate (KDP) crystals, deliquescent polishing technology for KDP crystals, which utilizes deliquescent effect for ultraprecision machining KDP crystals, is proposed. The principle and the advantages of technology are introduced. The deliquescent polishing procedure of KDP crystals is given. The deliquescent polishing experiments of KDP crystals are conducted, and the material removal ratios are calculated. Through the experiments, the effect of four processing parameters (velocity of polishing plate, velocity of drip, volume percentage of water in the deliquescent polishing fluid, polishing pressure) on material removal ratio in the deliquescent polishing of KDP crystals is researched. The plot of material removal ratio versus every processing parameter in the deliquescent polishing of KDP crystals is obtained, and the rules of material removal ratio in the deliquescent polishing of KDP crystals are reached.
机译:提出了一种新的磷酸二氢钾(KDP)晶体超精密加工技术,即利用潮解作用对KDP晶体进行超精密加工的KDP晶体潮解抛光技术。介绍了技术的原理和优点。给出了KDP晶体的潮解性抛光程序。进行了KDP晶体的潮解性抛光实验,并计算了材料去除率。通过实验,研究了KDP晶体潮解性抛光中四个工艺参数(抛光板的速度,滴速,潮解性抛光液中水的体积百分比,抛光压力)对材料去除率的影响。得到了KDP晶体潮解抛光中材料去除率与每个工艺参数的关系图,得出了KDP晶体潮解抛光中材料去除率的规律。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号