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Temperature Dependence of Resistivity of MoSi_2-Si Composite Thin Films

机译:MOSI_2-Si复合薄膜电阻率的温度依赖性

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The temperature dependence of resistivity for thin films of a composite of molybdenum disilicide (MoSi_2) and silicon (Si) fabricated by radio frequency magnetron sputtering using a target made of a powder mixture of MoSi_2 and Si with molar ratio of Si to Mo of 1 :X (2.02≤X≤2.55) was analyzed. The temperature dependence could be explained by the multiplicative model consisting of a conduction model similar to the Gruneisen-Bloch model, a modified Anderson localization model for 2.02≤X≤2.21 and the modified Anderson localization model for 2.39≤X≤2.55 over a wide temperature range.
机译:使用由MOSI_2和Si的粉末混合物制成的射频磁控溅射由射频磁纤维溅射制成的硅硅化钼(MOSI_2)和硅(Si)的复合材料的薄膜的温度依赖性使用Si至Mo的摩尔比为1: 分析X(2.02≤x≤2.55)。 由类似于Gruneisen-Bloch模型的传导模型组成的乘法模型可以解释温度依赖性,其修改的Anderson定位模型为2.02≤x≤2.21和改进的Anderson定位模型,在宽温度下为2.39≤x≤2.55 范围。

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