Diamond bit cutting for processing high topography wafers

摘要

In this paper we report the results of diamond bit cutting on metals, such as Cu and Sn, polymers, temporary glue and polyimide. Diamond bit cutting is an attractive, fast and economically viable option when processing on high topography wafers is required, or when smooth surface finish is required. Diamond bit cutting can planarize the surface of the high topography features on which conventional IC processing steps can be performed with ease.