首页> 外文会议>Electronics Packaging Technology Conference, 2009. EPTC '09 >Finite Element simulation of inkjet printed strain gage on polyimide substrates applied to flexible boards
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Finite Element simulation of inkjet printed strain gage on polyimide substrates applied to flexible boards

机译:应用于柔性板上的聚酰亚胺基材上的喷墨印刷应变计的有限元模拟

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In this present work simulation models were obtained in order to develop tools for early stages of design of a new strain gauge by numerical modeling. The strain deformation was extracted by FEM simulation. Moreover, a correlation with experimental results was established in order to understand the efficiency of FEM results. It was observed that the finite element method is an adequate methodology to evaluate the strain-stress behavior of printed strain gauge in flexible structure. Moreover, the printed strain gauge found to be a suitable technology to be applied in flexible boards. Therefore, it could be applied as a direct method to measure strain deformation in flexible printed boards (FPCBs). It was also observed that, in an early product design stage, the FEM could be applied to simulate printed strain gauge during mechanical strain tests.
机译:在本工作中,为了通过数字建模开发用于设计新应变仪的早期阶段的工具,获得了工作仿真模型。通过有限元模拟提取应变变形。此外,建立与实验结果的关联,以了解有限元结果的效率。观察到,有限元方法是评估挠性结构中印刷应变仪的应变-应力行为的适当方法。而且,发现印刷应变仪是一种适用于柔性板的合适技术。因此,它可以作为一种直接方法来测量柔性印刷电路板(FPCB)中的应变变形。还观察到,在产品设计的早期阶段,可以将FEM应用于机械应变测试期间的模拟印刷应变仪。

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