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Development of a Measuring System for Shape and Dimension Determination of Micro-components

机译:开发用于微零件形状和尺寸测定的测量系统

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This study seeks to develop a system for measuring the three-dimensional (3D) shape and dimensions of micro-components using a micro-probe (nose radius: <1 μm). Recent developments in high-precision manufacturing technologies have resulted in an increased need for micro-shape evaluation technologies. However, numerous factors have been reported that affect the reliability of micro-component measurements and the degree of uncertainty has increased or decreased dramatically as the size of micro-components has decreased. In particular, the effect of surface profile characteristics such as surface roughness has increased. In addition, establishing datum on micro-components is considerably difficult. It is therefore important to acquire a variety of data, such as surface roughness, shape and size relating to a workpiece after the datum has been established.By detecting the proximity of the probe to the measured sample, and by using the tunneling effect, our measurement system can measure micro-shape without contact. Using a precision PZT stage, the positioning accuracy of the system is 10 nm within a 500×500×500 μm cube. The response speed of the PZT stage, which is controlled by a computer, is not sufficient to avoid collision of the measurement object with the probe. In order to avoid such collisions, the probe employs what we refer to as a Probe Over-travel Protection System to affect rapid probe control. This protection system is driven by 10-μm stroke piezoelectric actuators, and is controlled directly by a simple electronic circuit.Using the current measurement system and a titanium probe, micro-components can be measured to an accuracy of 64 nm, at a rate of three measurement points per second. In addition, our system employs a three-dimensional (3D) optical measurement system that uses the Shape from Focus (SFF) method to assist withprobe positioning. If a workpiece with asperities ranging from several μm to tens of |xm were to be examined, then it is important that the measurement system has visual-assist capability to facilitate precise positioning of the probe at a specific point.In general, two or more cameras are required to produce a 3D picture through image processing. However, the SFF method can be used to generate a 3D figure using data collected by a microscope fitted with a CCD (charge-coupled device) camera. Using this optical system, it is possible to obtain an approximate 3D representation of the target, which can then be used to optimize the path of the probe. An import facet of the visual-assist system is that it reduces measurement time by more than 50%.In this research, we describe the configuration of the measurement system in detail, and then we verify the validity of this measurement system using several measurement examples.
机译:这项研究旨在开发一种使用微探针(鼻子半径:<1μm)测量微组件的三维(3D)形状和尺寸的系统。高精度制造技术的最新发展导致对微观形状评估技术的需求增加。然而,已经报道了许多影响微组件测量可靠性的因素,并且随着微组件尺寸的减小,不确定性的程度已经显着增加或减少了。特别地,诸如表面粗糙度的表面轮廓特征的影响已经增加。此外,在微组件上建立基准非常困难。因此,重要的是在建立基准之后获取各种数据,例如与工件有关的表面粗糙度,形状和尺寸。 通过检测探头与被测样品的接近程度,并利用隧穿效应,我们的测量系统可以在不接触的情况下测量微观形状。使用精密PZT平台,系统在500×500×500μm立方体内的定位精度为10 nm。由计算机控制的PZT位移台的响应速度不足以避免测量对象与探头碰撞。为了避免此类碰撞,测头采用了我们称为测头超程保护系统的系统来影响测头的快速控制。该保护系统由10-μm行程压电执行器驱动,并由简单的电子电路直接控制。 使用电流测量系统和钛探针,可以以每秒三个测量点的速率将微组分测量到64 nm的精度。此外,我们的系统采用了三维(3D)光学测量系统,该系统使用“聚焦形状”(SFF)方法进行辅助 探头定位。如果要检查的粗糙度范围从几微米到几十微米| xm,那么重要的是,测量系统应具有视觉辅助功能,以利于探针在特定点的精确定位。 通常,需要两个或更多相机通过图像处理来产生3D图片。但是,SFF方法可用于使用配备有CCD(电荷耦合器件)相机的显微镜收集的数据生成3D图形。使用该光学系统,可以获得目标的近似3D表示,然后可以将其用于优化探针的路径。视觉辅助系统的一个重要方面是,它可以将测量时间减少50%以上。 在这项研究中,我们详细描述了测量系统的配置,然后我们使用几个测量示例来验证该测量系统的有效性。

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