首页> 外文会议>9th International Conference on Solid-State and Integrated-Circuit Technology(第9届固态和集成电路国际会议)论文集 >Development of Passive Devices in 130 nm RFCMOS Technology and PDK Implementation for RF VCO Designs
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Development of Passive Devices in 130 nm RFCMOS Technology and PDK Implementation for RF VCO Designs

机译:130 nm RFCMOS技术中无源器件的开发以及用于RF VCO设计的PDK实现

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This paper focuses on the design of RF component design such as MOSFETs,varactors,capacitors and inductors in SMC 0.13um RFCMOS technology. Modeling results of these passives devices and associated PDK are implemented in a 0.13um RFCMOS VCO design. The RF building block has been fabricated from 130 nm CMOS technology and achieved a phase noise of -140.8dBc/Hz@1MHz at a current coasumption of 14mA.
机译:本文重点研究采用SMC 0.13um RFCMOS技术的MOSFET,变容二极管,电容器和电感器等RF组件的设计。这些无源器件和相关PDK的建模结果在0.13um RFCMOS VCO设计中实现。该射频构建块由130 nm CMOS技术制成,在14mA的电流共同消耗下实现了-140.8dBc/Hz@1MHz的相位噪声。

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