Effects of conductive particles on the strength of adhesion between conductive and non-conductive polymer compounds

摘要

Articles with surface conductive layers molded onto virgin polymers provide mechanical strength of virgin polymers and sufficient surface conductivity with small amounts of conductive particles, thus obviating the needs of molding the whole articles from conductive polymer compounds. Multi-layer molding methods, such as coextrusion, injection-compression, compression molding, etc. can be used provided the adhesion between conductive and non-conductive layers is strong. This paper describe the effects of particle concentration and polymer molecular weight on the strength of adhesion in carbon black-filled polypropylene as measured by peel test and from changes in complex shear modulus of conductive/non-conductive sandwich compounds.