High Uniformity PCB Processing with Vacuum Gas Plasma

摘要

Emerging technologies in the printed circuit board industry including smaller holes, higher aspect ratios, three-dimensional features, fine pitch, blind via holes, and new lead free materials continue to challenge standard manufacturing methods. With these new technologies, plasma has become the chosen method for cleaning carbon/resin from laser formed blind vias, treatment of flex materials prior to lamination and etching lead-free materials and composite material constructions. The processing demand of these technologies has required improvements to the vacuum gas plasma process often used for desmear applications. Additional requirements including processing the high value product at a lower cost per panel are directly opposed to this new performance expectation. The new technology requirements translate directly to improved uniformity specifications for the plasma system, where the high value lower cost proposition drive cost of ownership and equipment configuration specifications. New plasma technology is required to meet the technology and cost demands. This paper describes one aspect of the technology development critical for improved uniformity.