首页> 外文会议>Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008) >Capability Study on the Destructive Pull Test of 1 Mil Gold Wire Bond and Its Asymmetric Distribution
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Capability Study on the Destructive Pull Test of 1 Mil Gold Wire Bond and Its Asymmetric Distribution

机译:1 Mil金线键合破坏性拉力试验及其不对称分布的能力研究

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The Statistical Process Control (SPC) of destructive pull test on 1 Au gold wire is studied on two High-Rel devices,namely #1 and #2. It was found that the Cpk of both parts are around 1.2, which have not meet our goal of 1.33 and the ultimately Six Sigma (Cpk= 2). However, this study shows that the traditional method of calculating Cpk has underestimated the capability of process control if considering the tolerance as asymmetric, such as the case for 1mil gold wire bond.
机译:对两种高阻器件#1和#2进行了1 Au金丝破坏性拉力试验的统计过程控制(SPC)研究。发现这两个部分的Cpk都在1.2左右,未达到我们的目标1.33和最终的6 Sigma(Cpk = 2)。但是,这项研究表明,如果将公差考虑为非对称的,则传统的计算Cpk的方法会低估过程控制的能力,例如100万金丝键合的情况。

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