Two mechanical removing methods are employed to be integrated with self-assembly process on the surface of silicon: (a) Cutting Si with a diamond tool in the hexadecane solution is performed, (b) AFM mechanical scratching technique is used to remove materials on the silicon surface followed by the chemical heating method. Microstructures and monolayer arise simultaneously on the silicon surface. Nano adhesion properties of both samples are also studied using AFM force-curve technique. It shows that the area with monolayer has less adhesion force than that without monolayer.
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