首页> 外文会议>International Conference of the European Society for Precision Engineering and Nanotechnology >E-beam sterilization of microstructures in titanium surfaces for medical implants
【24h】

E-beam sterilization of microstructures in titanium surfaces for medical implants

机译:医用植入物中钛表面微观结构的电子束灭菌

获取原文

摘要

Due to its biocompatibility titanium is the metal of choice for most medical implants. The surface in contact with the human body may be equipped with a functional microstructure for various purposes such as bone ingrowth. All implants must be sterilized before operation. Among other processes, the sterilization by low energy electron beam (e-beam-sterilization) offers a lot of advantages. The non-thermal sterilization works with short process times (milliseconds) and without microbicide gases. The radiation sterilization is a regulated process according to DIN EN ISO 11137, which describes a killing effect of microorganism after the validation of a dose of 25 kGy. In principal it is possible to sterilize all material classes, electronic devices and different geometries, so that the low energy e-beam-sterilization is a suitable method for multifunctional implants. The sterilization of surface microstructures with low energy e-beam-sterilization is challenging because of the limited penetration depth. The influence of high aspect ratio microstructures on low energy e-beam-sterilization was investigated experimentally. A microhole array with 230 μm hole diameter served as a model structure and was manufactured in the titanium surface by electrical discharge machining. Other surface microstructures were generated by laser machining and blasting. All samples were contaminated with 10~7 CFU/sample Escherichia coli (E. coli) K12, sterilized by e-beam and incubated in a culture medium in order to prove that the sterilization was successful. The microhole depth was varied to determine the critical depth for low energy e-beam-sterilization.
机译:由于其生物相容性钛是最具医疗植入物的首选金属。与人体接触的表面可以配备有功能性微观结构,用于各种目的,例如骨头发光。所有植入物必须在操作前进行消毒。在其他过程中,低能量电子束(电子束灭菌)的灭菌提供了很多优点。非热灭菌配合使用短的工艺时间(毫秒)和没有杀微生物剂气体。辐射灭菌是根据DIN EN ISO 11137的调节过程,其描述了在验证25kGy剂量后微生物的杀伤作用。在本金中,可以对所有材料类,电子设备和不同的几何形状进行消毒,从而低能量电子束灭菌是多功能植入物的合适方法。由于渗透深度有限,具有低能量电子束灭菌的表面微观结构的灭菌是具有挑战性的。实验研究了高纵横比微结构对低能电子束灭菌的影响。具有230μm孔直径的微孔阵列用作模型结构,并通过放电加工在钛表面中制造。通过激光加工和喷砂产生其他表面微结构。所有样品均含有10〜7个CFU /样品大肠杆菌(大肠杆菌)K12,通过电子束灭菌并在培养基中孵育,以证明灭菌是成功的。微孔深度变化以确定低能量电子束灭菌的临界深度。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号