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Microstructure and Electronic Properties of AI/Zr/LiNbO_3 Multilayers

机译:AI / Zr / LiNbO_3多层膜的微观结构和电子性能

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To obtain both high power durability and fine-dimensional control in high-frequency surface acoustic wave devices, a highly oriented (111) texture was developed in electronic beam evaporated Al films on Zr underlayer. In this paper, the effects of Zr underlayer on the microstructure and resistivity of Al/Zr/LiNbO_3 films were investigated. The films show an extremely smooth surface. The optimum annealing temperature is 200 °C to obtain low resistivity. For Al films with Zr underlayer, reactive ion etching with gases containing BCl3 can be more easily performed than that for Al films with Cu underlayer.
机译:为了在高频表面声波装置中获得高功率耐久性和精细尺寸控制,在Zr底层上的电子束蒸发Al膜中形成了高取向(111)织构。本文研究了Zr底层对Al / Zr / LiNbO_3薄膜的微观结构和电阻率的影响。薄膜显示出极其光滑的表面。最佳退火温度为200°C,以获得低电阻率。对于具有Zr底层的Al膜,与具有Cu底层的Al膜相比,使用含BCl3的气体进行反应性离子蚀刻更容易。

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