Nickel-palladium (NiPd) has been used as a semiconductor component lead finish since 1989.More than 50 billion devices are in the field with this lead finish. Within the past two years,nickel-palladium-gold (NiPdAu) has supplanted NiPd as the preferred pre-plated finish forperipherally leaded components. This paper will discuss the differences and advantages—anddisadvantages—of the NiPdAu lead finish relative to any post-mold finish and to NiPd.
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