X-ray Dynamical Defectoscopy: a Way to Study Damage Processes

摘要

Recent theoretical models describe the dynamic development of voids and micro-cracks in materials under plastic deformation. For these models, experimental verification is needed. We propose direct and non-destructive observation of the material damage evolution by measuring changes in transmission of X-rays penetrating a stressed material, using a photon-counting X-ray imager. The present contribution demonstrates the application of a silicon hybrid pixel detector as such imager for measurements with a specimen of high-ductile aluminium alloy. The results of the first experiments aimed to detect the nucleation and evolution of damage clusters by the Medipix-1 detector are presented.