Thin Film Capacitors Embedded into High Density Printed Circuit Boards

摘要

This paper describes an approach for embedding high value, thin film capacitors into high density multilayer printed circuit boards. Pb_(0.85)La_(0.15)(Zr_(0.52)Ti_(0.48))_(0.96)O_3 thin films are prepared by chemical solution deposition on 50μm Ni-coated Cu foils. Capacitance density and loss tangent values range between 300 and 400 nF/cm~2 and 0.01 and 0.02 from 1 to 1000 kHz respectively. Integration of these foils into a standard HDI process. The capacitance densities represent a 2 to 3 order of magnitude improvement over currently available embedded capacitor technologies for polymeric packages.