Study of a laser microwelding process for microelectronics and packaging

摘要

1. Thermal processes of laser beam interaction with metals in two-part microwelding were studied 2. FEM results for temperature distribution were obtained 3. Computer program to simulate stress/strain distribution of laser microwelding processes in metal was developed 4. Preliminary laser microwelding experiments were performed, during which temperature measurements were conducted 5. Comparison of computed and measured temperatures shows good correlation 6. Material properties in the HAZ were measured 7. Melting front of the laser welds was simulated 8. Future work 9. Characterize overall HAZ profile of laser microwelding 10. Consider EM effect on laser microwelding control