LASER-DRIVEN MICROWELDING APPARATUS AND PROCESS

摘要

A method and apparatus for laser microwelding and wire bonding apparatus with a laser source (116) such as a Nd:YAG laser, a second laser pulse source (122) for providing a visible aiming beam, the beams passing through an optical fiber (126) followed by a beam imaging system, followed by a beam splitter compartment (132). A monitoring system consisting of a camera (134) and a monitor (136) is used. In operation the laser pulses are applied to the end of an elongated length of conductive material to deform an end to a spherical shape, the spherical end is welded to a bonding pad, another laser beam is used to sever the elongated material, and the new end has a beam applied to deform it to a spherical shape, and the new end is microwelded to a second bonding pad.