High Thermal Conductivity Cubic Boron Nitride Thick Films

摘要

We report on the development of novel cubic boron nitride (c-BN) based thick films with unique physical and electronic properties. The films exhibit high thermal conductivity and electrical resistivity, properties useful in high density packaging. Multilayer Ceramic Integrated Circuits (MCIC's) may take advantage of such films to improve internal temperature distributions or to remove heat from the inside. Other applications are packaging, heaters for sensors and microsystems, heat spreaders, heat sinks, and high power components.