Electroforming of Stress-free Nickel from a Chloride Electrolyte by Use of Pulse Reverse Plating

摘要

A new patented industrial process for electroforming of nickel by use of a pulse reverse process hasbeen developed to replace the conventional sulphamate nickel process. A low stress level in thecoating over a wide current density range characterises the process. The material distribution hasshown better results than known from the conventional processes and with significant reduced buildupof nickel nodules upon corners with high current density. The electroforming process based on thistechnology is now industrially utilised in a 1,000-gal tank for manufacturing composite tools for thinsheet metalforming. The tool build-up consists of a 2 to 4 mm-thick nickel shell backed with achemically bonded ceramic and a strong durable structure is created.