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首页> 外文期刊>Electrochimica Acta >Pulse reverse plating of Ni-Co alloys: Deposition kinetics of Watts, sulfamate and chloride electrolytes
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Pulse reverse plating of Ni-Co alloys: Deposition kinetics of Watts, sulfamate and chloride electrolytes

机译:Ni-Co合金的脉冲反向电镀:瓦茨,氨基磺酸盐和氯化物电解质的沉积动力学

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摘要

Fundamental electrochemical properties of electrolyte systems are the prerequisite for the development of a successful pulse deposition process. Three different electrolyte systems for the galvanic deposition of nickel cobalt alloys (chloride, Watts and sulfamate type) were investigated in order to reveal underlying deposition mechanisms and rate determining factors. The electrochemical experiments were supported by X-ray fluorescence analyses of the alloy composition in dependence on the current density and the type of bath. A special focus was set on the investigation of the passive (oxide) layer formation by the anodic pulses. The choice of electrolyte system strongly influences the reaction mechanism and thus the alloy deposition. Also the cobalt content within the deposited layer varied strongly in dependence on the electrolyte system used. While sulfamate and Watts baths show an ability for passive layer formation, the chloride bath exhibits a lower proneness to passivation, accompanied by pit formation
机译:电解质系统的基本电化学特性是成功开发脉冲沉积工艺的前提。为了揭示潜在的沉积机理和速率决定因素,研究了三种用于镍钴合金电沉积的不同电解质体系(氯化物,瓦茨和氨基磺酸盐类型)。根据电流密度和熔池类型,通过合金成分的X射线荧光分析来支持电化学实验。一个特别的重点是研究阳极脉冲对被动(氧化物)层的形成。电解质体系的选择强烈影响反应机理,进而影响合金沉积。而且,沉积层中的钴含量根据所用的电解质体系而强烈变化。虽然氨基磺酸盐和瓦茨浴显示出形成钝化层的能力,但氯化物浴显示出较低的钝化倾向,并伴有凹坑形成

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