ADVANCES IN DEEP OXIDE ETCH PROCESSING FOR MEMS -MASK SELECTION

摘要

This paper presents the latest developments in high quality oxide etching using a new planar ICP source (the AOE source) which has been specifically designed for dielectric etch applications. Three types of masking systems, photoresist, silicon and metal have been investigated and the suitability of each mask type for a range of MEMS and optoelectronics applications will be discussed.