Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process

摘要

Transient thermal simulation was performed to analyze thermal response of the assembly process for a package using Anisotropic Conductive. Film (ACF). Two assembly processes were modeled: a simplified process where the package was fixed at two differnt temperatures during assembly, and a detailed process where the package experienced a ramping heating process, followed by a constant temperature curing process. A 3D conjugate Computational Fluid Dynamics (CFD) study was first conducted, followed by a 3D conduction-only analysis due to the minimal effect of convectionand radiation.