High Density Build-Up Printed Board, 'DV-MULTI' With Ultra Fine Solder Metallic Bump

摘要

The very high density build-up printed board named "DV-MULTI" with the design geometry of 25 micron meters line width and spacing, 50 micron meters via and 85 micronmeters land diameters has been developed by the combination of laser microvia processing and fully additive processing for the high density interconnection such as multichip module (MCM) package and chip size package (CSP). Furthermore, on the DV-MILTI printed board, three bump forming methods have been investigated with the following technologies. Not only simplified processes, but alsothe ultra fine solder bumps and metallic bumps are quite easily performed.