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Effect of Surface Modification Al OR Ti Film On BOnd Strength of Joining Aluminum Nitride to Metals

机译:表面改性的Al或Ti膜对氮化铝与金属结合强度的影响

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Radio frequency sputtering nad plasma spraying surface engineering methods were introudced to join aluminum nitride ceramic to metals. The effect ofsurface modificaiton Al or Ti film on the bond strength of joining AIN ceramic to metals was studies bases on the process conditions, microstructures, reaction products and residual stresses distributions of AIN/interlayer/metal joints. R.F.sputtering was first applied to deposited surface modification aluminum or titanium film on AIN ceramic. Then brazing with AGCU19.5Ti3In5 filler nad idffusio bonding proceses were investigated to join the different surface modified AIN ceramics to Cu and FeNi42 metals. The strength of the joints was improved because the interfacial surface modification AL or Ti film imporved the wettability of AIN. The maximum bond strength of 127 MPa and 176MPa could be obtained for brazing surface modified AIN to Cu and to FeNi42 respectively at 1173K for 20min. And the bond strength of diffusion bonding AIN to C joint could be improved further with a functionally gradient material interlayer coated using p;asma spaying
机译:介绍了射频溅射和等离子喷涂表面工程方法,以将氮化铝陶瓷与金属结合起来。基于AlN /中间层/金属接头的工艺条件,微观结构,反应产物和残余应力分布,研究了表面改性Al或Ti膜对AlN陶瓷与金属结合强度的影响。首先将R.F.溅射应用于在AIN陶瓷上沉积的表面改性铝或钛膜。然后研究了用AGCU19.5Ti3In5钎料钎焊和钎焊工艺,以将不同表面改性的AIN陶瓷连接到Cu和FeNi42金属上。由于界面表面改性AL或Ti膜改善了AIN的润湿性,因此提高了接头的强度。将表面改性的AIN分别钎焊到Cu和FeNi42上,在1173K下焊接20分钟,可获得最大127 MPa和176 MPa的粘结强度。通过使用p; asma spading涂覆功能梯度材料夹层,可以进一步提高AIN与C接头的扩散结合的结合强度

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