LOW TEMPERATURE JOINING METHOD BETWEEN TI/TI-BASED ALLOYS HAVING A BONDING STRENGTH HIGHER THAN THOSE OF BASE METALS

摘要

PURPOSE: A low temperature junction method of Ti/Ti-based alloys is provided to achieve improvement of strength by heating a zirconium-based interposer at a low temperature less than 900C over the melting temperature to join Ti/Ti-based alloy base materials. CONSTITUTION: A low temperature junction method of Ti/Ti-based alloys is as follows. A zirconium-based interposer is positioned between the Ti/Ti-based alloy base materials and heated at a low temperature less than 900C over the melting temperature, thereby joining the Ti/Ti-based alloy base materials. The zirconium-based amorphous interposer is composed of zirconium 20~50 atomic percentage, titanium 5~50 atomic percentage, copper 5~25 atomic percentage, nickel 1~20 atomic percentage, and beryllium 15~35 atomic percentage.