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首页> 外文期刊>日本セラミックス協会学術論文誌 >Interfacial Microstructures and Bonding Strength between Aluminum Nitride and Silver Brazing Filler Metals Containing Various Active Elements
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Interfacial Microstructures and Bonding Strength between Aluminum Nitride and Silver Brazing Filler Metals Containing Various Active Elements

机译:氮化铝与含各种活性元素的银钎料之间的界面微结构和结合强度

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摘要

Effect of active element on interfacial microstructures and bonding strength of brazed A1N/AIN joints has been investigated and compared with the case of brazed Si_3N_4/Si_3N_4 joints.Brazing was carried out at 1173 to 1473 K for 3.6 ks in a vacuum using Ag-Cu filler metals containing Ti,Zr,V and Nb as an active element.The obtained joint had no defects such as un-bonded areas,regardless of active element and bonding temperature.Four kinds of active elements were divided into two groups by shear tests and microstructural observations.One was Ti and Zr,and the other was V and Nb.The bonding strength of the former was higher than that of the latter.In particular,the joint with Ti addition showed an excellent strength of about 200 MPa.Main fracture position in the joints with Ti and Zr additions was within the A1N,while most joints with V and Nb additions broke at the interface between the active filler metal and the A1N.In the former,TiN and ZrN layers consisting of fine grains were observed adjacent to the A1N.On the other hand,the joint with Nb addition had roundish grains of Nb_2N in similar locations.It was considered that the existence of fine grains contributed to the enhancement of bonding strength due to the increase of contact area and to the formation of complicated interface.These tendencies were essentially consistent with those of the brazed Si_3N_4/Si_3N_4 joints.
机译:研究了活性元素对钎焊A1N / AIN接头的界面微观结构和结合强度的影响,并将其与钎焊Si_3N_4 / Si_3N_4接头的情况进行了比较.Ag-Cu在真空中于1173至1473 K进行了3.6 ks的钎焊以Ti,Zr,V和Nb为活性元素的填充金属。所得的接头无缺陷,无论活性元素和键合温度如何,均具有未结合区域的缺陷。通过剪切试验将四种活性元素分为两组。显微组织观察。一个是Ti和Zr,另一个是V和Nb。前者的结合强度高于后者,特别是添加Ti的接头显示出约200 MPa的优异强度。掺Ti和Zr的接头的位置在AlN内,而大多数掺V和Nb的接头在活性填充金属与AlN的界面处破裂。在前者中,观察到由细晶粒组成的TiN和ZrN层另一方面,添加Nb的接缝在类似的位置具有圆形的Nb_2N晶粒。人们认为,细晶粒的存在由于接触面积的增加和表面活性的增加而有助于增强结合强度。这些趋势基本上与钎焊的Si_3N_4 / Si_3N_4接头的趋势一致。

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