Residual Stress Developed During the Cure of Thermosetting Polymers: Optimizing Cure Schedule to Minimize Stress

摘要

When thennosetting polymers are used to bond or encapsulate electrical, mechanical or optical assemblies, residual stress develops within the structure. This stress often affects the performance and/or reliability of these devices. Understanding the origins of the stress and how it evolves over time is key to defining strategies to minimize or alter the stress, with aims at eliminating impact on device performance.