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Synchrotron radiation for microstructure fabrication

机译:同步辐射用于微结构制造

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Most of the presently known microstructures are still fabricated using silicon-based technologies. Hoever, in the case of abrication using ansiotropic etching, geometrical limitations due to the crystallograhpic nature of silicon prevent the design of any in-plane structure shapes. If microsystems, built by means of reactive ion etiching and scrificial layer technology do have freedom for lateral geometry, they are limited to a few micrometers height only. Nevertheless, and in spite of difficulties to always answer the demands in the best way, real microsystemsare produced by these techniques and are currently present on the market. To overpass these limitations, other technologies have been studied and developed in recent years. among them the LIGA process (German acronym for Lithography, Electroplating, Molding), which uses synchrotron radiation and in particular its hard X-Ray spectrum, is certainly the most promissing one regarding to, very high aspect ratio, submicron precision, arbitrary patterning and mass production capabilities. Furthermore, LIGA can handle a large variety of materials to fabricate microsystems.
机译:目前大多数已知的微结构仍使用基于硅的技术来制造。但是,在使用各向异性蚀刻进行消融的情况下,由于硅的晶体学性质而导致的几何限制会阻止任何平面内结构形状的设计。如果借助反应离子刻蚀和牺牲层技术构建的微系统确实具有横向几何形状的自由度,则它们只能限制在几微米的高度。尽管如此,尽管难以始终以最佳方式满足需求,但通过这些技术仍可生产出真正的微系统,并且目前已在市场上出现。为了克服这些限制,近年来已经研究和开发了其他技术。其中,LIGA工艺(德语为Lithography,Electroplating,Molding的首字母缩写)使用同步加速器辐射,尤其是其硬X射线光谱,对于高纵横比,亚微米精度,任意图案化和批量生产能力。此外,LIGA可以处理多种材料来制造微系统。

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