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Secondary ion mass spectrometry (SIMS) applications on characterization of RF NPN bipolar polysilicon emitter process

机译:二次离子质谱(SIMS)在表征RF NPN双极多晶硅发射极工艺中的应用

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The device design for the cutting edge RF npn bipolar polysilicon emitter transistrors (PETs) is required to reduce the volume of N~+ emitter single crystal region and the vertical width of the p-type base region. In addition, due to the extremetly sensitive nature of the interface between polysilicon/monosilicon, a well controlled and characterized interface plays a key role in fabricating reproducible PETs. SIMS measurements of the interfacial oxide have established a very good correlation between the interfacial oxide thickness and the device h_(FE) performance. The reduction of the interfacial oxide from 7-8 A to 3-4 A results in a controllable h_(FE) (current gain) with very uniform distribution within wafer and very good reproducibility. Furthermore, the experimental results have shown that a total elimination of the interfacial oxide by in-situ polysilicon deposition coupled with H_2 bakig resulted in a complete epitaxial realignment of polycrystalline silicon to the underlying single crystal silicon. This single crystal emitter contact prevented efficient arsenic diffusion into substrate to form the critical n~+ emitter single crystal region.
机译:需要用于尖端RF npn双极多晶硅发射极晶体管(PET)的器件设计,以减少N〜+发射极单晶区域的体积和p型基极区域的垂直宽度。另外,由于多晶硅/单晶硅之间的界面极其敏感,因此,良好控制和表征的界面在制备可再生PET中起着关键作用。界面氧化物的SIMS测量已在界面氧化物厚度与器件h_(FE)性能之间建立了很好的相关性。界面氧化物从7-8 A减少到3-4 A导致可控制的h_(FE)(电流增益),且在晶片内分布非常均匀,并且具有很好的重现性。此外,实验结果表明,通过原位多晶硅沉积与H_2 bakig耦合完全消除了界面氧化物,导致多晶硅与下面的单晶硅完全外延重排。这种单晶发射极接触阻止了砷有效扩散到衬底中,从而形成了关键的n +发射极单晶区域。

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