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Have WE forgotten about true lfe cycle cost in electronics assembly? (OR how to be a hero in your boss's eyes)

机译:我们是否忘记了电子组装中真正的生命周期成本? (或者如何成为老板眼中的英雄)

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摘要

Electronics assembly technology has seen much change in the past twently-five years. COmponent packaging, Printed board fabrication technology, and even soldering technology has evolved rapidly. Howev we accomplish the production of the electronic assembly has also changed. COnsolidation in the electronics assembly industry is frequent. Company buy-outs and mergers are happening daily. Many companies have decided to build product outside of the United States. Competition is on a global basis. More contract manufacturers exist toady than ever. What has not changed is how a solder connection is made. We may decide to make multiple connections at once, use exotic alloys and unconventional fluxes, but the process of soldering itself has not changed.
机译:电子装配技术在过去的纯度五年中看到了很大的变化。部件包装,印刷电路板制造技术,甚至焊接技术迅速发展。 HOVEV我们完成了电子组件的生产也发生了变化。电子装配行业的整合频繁。公司购买和兼并日常发生。许多公司已经决定在美国以外的产品建造产品。竞争在全球范围内。更多的合同制造商与以往任何时候都存在吐具。没有改变的是如何制作焊料连接。我们可以决定立即进行多次连接,使用异国情调的合金和非传统的助焊剂,但焊接本身的过程并没有改变。

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