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Novel emitter structures for field emission displays

机译:用于场发射显示器的新型发射器结构

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Flat panel display devices today are manufactured almost exclusively using liquid crystal and active matrix liquid crystal technologies. Although these processes have been developed and continually refined for a number of years the manufactured panels still suffer problems with viewing angle, display brightness, and robustness. For these reasons and because of the overwhelming market demand, a number of alternative technological approaches are presently being developed. Amongst these new approaches, FEDT (Field Emission Display Technology) is one that could provide many improvements. In this paper we report on progress on individual steps towards development of a novel approach for the fabrication of nanometer size emitter array structures for field emission displays. These processes compatible with standard semiconductor processing techniques, provide the means to fabricate arrays with an aspect ratio of 100:1 without the use of sub-micron lithography. Test results to date have determined the field emission current density is approximately 30 mA/cm$+2$/ for applied fields of 4.5 V/um and the emission site density is estimated at 10$+8$//cm$+2$/.
机译:目前平板显示装置几乎专门地使用液晶和有源矩阵液晶技术制造。虽然这些过程已经开发并连续地改装了多年的历史,但是制造的面板仍然遭受观察角度,显示亮度和稳健性的问题。由于这些原因,由于压倒性的市场需求,目前正在开发许多替代技术方法。在这些新方法中,FEDT(现场排放显示技术)是可以提供许多改进的方法。在本文中,我们向各个步骤促进开发用于纳米尺寸发射极阵列结构的新方法的各个步骤的进展报告了用于场发射显示器。这些处理与标准半导体处理技术兼容,提供了在不使用子微米光刻的情况下制造具有100:1的纵横比的阵列的装置。迄今为止的测试结果已经确定了场发射电流密度约为30 mA / cm $ + 2 $ /适用于4.5 V / UM的应用字段,估计排放站点密度为10美元+ 8 $ // cm $ + 2 $ /。

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