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Novel emitter structures for field emission displays

机译:用于场发射显示器的新型发射器结构

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Abstract: Flat panel display devices today are manufactured almost exclusively using liquid crystal and active matrix liquid crystal technologies. Although these processes have been developed and continually refined for a number of years the manufactured panels still suffer problems with viewing angle, display brightness, and robustness. For these reasons and because of the overwhelming market demand, a number of alternative technological approaches are presently being developed. Amongst these new approaches, FEDT (Field Emission Display Technology) is one that could provide many improvements. In this paper we report on progress on individual steps towards development of a novel approach for the fabrication of nanometer size emitter array structures for field emission displays. These processes compatible with standard semiconductor processing techniques, provide the means to fabricate arrays with an aspect ratio of 100:1 without the use of sub-micron lithography. Test results to date have determined the field emission current density is approximately 30 mA/cm$+2$/ for applied fields of 4.5 V/um and the emission site density is estimated at 10$+8$//cm$+2$/. !17
机译:摘要:如今的平板显示设备几乎都是使用液晶和有源矩阵液晶技术制造的。尽管已经开发了这些方法并对其进行了持续改进多年,但制造的面板仍存在视角,显示器亮度和坚固性方面的问题。由于这些原因,并且由于市场需求旺盛,目前正在开发许多替代技术方法。在这些新方法中,FEDT(场发射显示技术)可以提供很多改进。在本文中,我们报告了开发用于场发射显示器的纳米尺寸发射器阵列结构的新颖方法的各个步骤的进展。这些与标准半导体加工技术兼容的工艺提供了无需使用亚微米光刻技术即可制造纵横比为100:1的阵列的方法。迄今为止的测试结果已经确定,对于4.5 V / um的施加场,场发射电流密度约为30 mA / cm $ + 2 $ /,发射点密度估计为10 $ + 8 $ // cm $ + 2 $。 /。 !17

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