MATERIALS AND MANUFACTURING ISSUES IN MEMORY MODULES-WAFER THINNING

摘要

With the memory clock speed, density, and performance continually being pushed upward relentlessly, packaging and assembly for high-density memory devices such as flash memory, dynamic random access memory (DRAM), and static random access memory (SRAM) are changing to thin, multi-stack chip scale packages (CSP). This paper presents an update of the market and technical trends in the application of packages for memory devices. In particular, the thinning process of wafers to achieve thin memory devices for very thin chip scale packages such as VFBGA is described in detail. The material and performance requirements for the packages and module are discussed based on manufacturing process and reliability concerns.