Demand For Specialist Materials and Components In Optoelectronic Communications Modules

摘要

Optoelectronic modules used in communications can range from simple TO cans for lasers and photodiodes, through DIP and butterfly packages for higher end modules, to complex multichip module assemblies for transceiver modules. Both organic and inorganic materials are key to the economical high volume production of such modules. Organic materials include adhesives, coupling agents, bonding materials, and protective materials. Inorganic materials include silicon microbenches, ceramic platforms, waveguides, lenses, and active devices. Demand for such materials and components is growing and changing rapidly as demand for optoelectronic modules develops and modules are redesigned for higher volume production. This paper reviews the material and component content and specifications for the major families of optoelectronic modules, and it forecasts future demand for such materials and components.