Conceptual Simulator for Thermal Design of High Speed and High Density Electronics System

摘要

Recently, conceptual design for high speed and high density electronics system has been researched and developed from the viewpoint of electrical circuits design. But, designers of electrical system will have to consider from both viewpoints in the near future. Furthermore, new packaging, assembly, board and interconnection technologies have been appeared. Then, we researched and developed a conceptual simulator for thermal design of high speed and high density electronics system with the examination function of the new technologies using. Finally, we construct the conceptual simulation for high speed and high density electronics system by technology modularized modeling method.