Incorporation of linear/nonlinear lumped circuit models in a full-wave electromagnetic simulator for transient electromagnetic analysis of high-speed electronic systems.

摘要

A new methodology for coupling rigorous, vectorial transient electromagnetic analysis with nonlinear circuit analysis for the prediction of electrical performance of high-speed electronic systems is presented. This approach facilitates the direct analysis of signal propagation through complex interconnection networks and provides for a rigorous, realistic prediction of the electrical performance of very high speed packaged electronic systems. An important application of this methodology is in the investigation of limits of traditional lumped circuit/transmission line-based simulation that, so far, has been routinely used for electrical analysis of packaged electronics. In addition, through its detail modeling of all electromagnetic effects it helps enhance the understanding of the impact of package parasitics on electronic systems as signal speeds and interconnect medium density and complexity are increased. Finally, the proposed methodology provides an example and, in many respects, sets the foundation for the new generation of CAD tools for electrical analysis of future high-speed electronic systems.; Investigations were performed to characterize pulse transmission through first-level interconnects, like bond wires, to facilitate the accurate modeling of the electromagnetic phenomena occurring at the chip-to-package interface. Comparisons of the results obtained by this method with those obtained using SPICE simulations of properly constructed equivalent circuits are used to validate the method and demonstrate its application.; Important cross talk and Simultaneous Switching Noise issues in microelectronics packaging field were also studied to shed more light into packaged induced noise generation and its impact on signal degradation. Through detailed modeling of all geometric and material characteristics of the package, the proposed methodology accounts explicitly for all parasitics associated with power/ground connections and chip-to-package interfaces; consequently, all electromagnetic effects are modeled rigorously.; Since electromagnetic field information at every point inside the package is generated, the methodology provides us with the ability to monitor current flow in the interconnect network as well as power and ground voltage fluctuations during switching. Specific case studies are presented that illustrate this capability and provide further insight on the package related noise generation mechanisms. Other potential applications of the proposed methodology in the electromagnetic modeling of both digital and analog (RF/microwave) electronic components and systems are also discussed.