Temperature insensitive AWG module by stress control

摘要

New temperature insensitive AWG module has been developed, due to controlling the stress applied to the waveguide by sticking a piece of bimetal plate on the backside of AWG chip. This epochal AWG modules is promising to be employed in the Metro DWDM systems in the near future. This novel AWG module exhibits excellent property in temperature dependence with less than +/-0.03 nm of the center wavelength shift under temperature change from 0 to 70 deg C of, and is sufficiently usable for multiplexer / demultiplexer of D-WDM systems without any temperature control. Basically, this temperature insensitive technology doesn't depend on size and design of the chip, that is number of the channal and channel spacing. And it is also suitable for mass production with low cost.