The role of quality and test modeling in the manufacture of complex electronic assemblies

摘要

High complexity circuit boards with node and solder joint counts approaching 5000 and 30,000 respectively pose a unique set of challenges for today's electronics manufacturers. Electronics assemblies of this nature are often manaufactured in high mix and low to medium volume environments which constrain porcess yield optimization activities that might otherwise have happended in high volume environments with dedicated manufacturing lines. Shortened product life cycles and increased `time to market' and `time to volume' pressure further increase the improtance of sound judgement and up-front planning in devising an effective manufacturing and inspection/test strategy.