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Selective epitaxial growth of Si_(1-x)Ge_x on SiO_2-patterned Si substrate using elemental source molecular beam epitaxy

机译:使用元素源分子束外延的Si_2-图案Si衬底上的Si_(1-X)Ge_x的选择性外延生长

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The selectrive epitaxial growth (SEG) of Si_(1-x)Ge_x(0.0 <=x<=1.0) on SiO_2-patterned Si(100) substrate was investigated using the elemental source molecular beam epitaxy. The dependence of the behavior of incident Si and Ge atoms was studied on the subtrate temperature and the flux. The fluxes of source beams and the substrate temperatures were in the range of 1.0 x10~(13)-2.9x10~(14)cm~(-2)s~(-1) and 600-800 deg C, respectively. Under SEG condition, the Ge atoms were reevaporated from the oxide surface and were not solely effective in etching SiO_2. However, Ge contributed to etch the oxide layer with accompanying si flux. The etch rate at a Si flux of 1.0x10~(13) cm~(-2)s~(-1) was about 0.85A/min, and then increased to 1.7A/min with accompanying Ge flux of about 2.0x10~(13)cmm~(-2)s~(-1). It was also shown that the SEG of Si_(1-x)Ge_x was achieved by the SiO_2 etch due to the concurrent atomic fluxes of Si and Ge, and in part by the reevaporation of Ge atoms rom SiO_2 surface. The effect of source ions and electrons naturally generated form an electron beam evaporator was also investigated on the SEG characteristics of Ge. The result exhibited that the incident charged particles enhanced the nuceleation of source atoms on SiO_2 surface to negatively affect the SEG of Si_(1-x)Ge_x.
机译:使用元素源分子束外延研究Si_2-图案化Si(100)衬底上的Si_(1-X)Ge_x(0.0 <= x <= 1.0)的SEREXTIVE外延生长(0.0 <= x <= 1.0)。研究了Si和Ge原子的行为的依赖性对所述混合物温度和助焊剂进行了研究。源极束的助熔剂和基板温度分别为1.0×10〜(13)-2.9x10〜(14)cm〜(-2)s〜(-1)和600-800℃。在SEG条件下,从氧化物表面恢复GE原子,并且在蚀刻SiO_2中并不仅仅有效。然而,GE有助于蚀刻伴随Si通量的氧化物层。 Si通量为1.0×10〜(13)cm〜(-2)S〜(-1)的蚀刻速率为约0.85A / min,然后随着GE通量的约2.0x10〜 (13)CMM〜(-2)S〜(-1)。还表明,由于Si和Ge的同时原子磁通,并且部分通过GE原子ROM SiO_2表面的Reevapatoration,通过Si_2蚀刻来实现Si_(1-x)Ge_x的SEG。还研究了Ge的SEG特征,还研究了源离子和电子自然形成的形成电子束蒸发器。结果表明,入射的带电粒子增强了SiO_2表面上的源原子的核心,以对Si_(1-x)Ge_x的SEG负面影响。

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