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Fabrication of GaN with buried tungasten (W) structures using epitaxial lateral overgrowth (ELO) via LP-MOVPE

机译:通过LP-MOVPE使用外延横向过度过度过度过度过度覆盖(ELO)的掩埋汤孢菌(W)结构的GaN的制造

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A buried tungsten (W) mask structure with GaN is successfully obtained by epitaxial lateral overgrowth (ELO) technique via low-pressure metalorganic vapor phase epitaxy (LP-MOVPE). The selectivity of GaN growth on the window region vs. the mask region is good. An underlying GaN with a striped W metal mask is easily decomposed above 500 deg C by the W catalytic effect, by which rdical hydrogen is reacted ith GaN, It is difficult to bury the W mask becasue severe damage occurs in the GaN epilayer under the mask. It is found that an underlying AlGaN/GaN layer with a narrow W stripe mask width (mask/window chemical bounds 2/2 mu m) leads the ELO GaN layer to be free from damage, resulting in an excellent W-buried structure.
机译:通过低压金属气相外延(LP-MOVPE)通过外延横向过度疏入(ELO)技术成功地获得了具有GaN的掩埋钨(W)掩模结构。 GaN生长在窗口区域对掩模区域的选择性良好。具有条纹W金属掩模的底层GaN通过W催化作用容易地分解在500℃以上,通过该效应,通过该效应使得甘露甘油反应,难以掩埋,在掩模下的GaN外膜中发生严重损伤。 。结果发现,具有窄W条纹掩模宽度的底层AlGaN / GaN层(掩模/窗口化学界2/2μm)导致ELO GaN层免受损坏,导致优异的W埋地结构。

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